The Assam government has halted an ongoing survey for a proposed satellite township near the upcoming Tata semiconductor project in Morigaon district following protests by Tiwa and Bodo community organisations. An official order issued by Morigaon District Commissioner Anamika Tewari on May 18 stated that the survey work connected to the proposed township had been cancelled with immediate effect after objections were raised by several groups and local residents. The district administration had earlier started survey work in Sindhisar, Naldhara and Bihita villages near Jagiroad as part of preparations for a relocation and rehabilitation proposal linked to the planned township project. However, the move led to strong opposition from tribal communities living in the area, particularly residents of villages located within the Gobha tribal belt. Local organisations and residents expressed concern that the proposed township could eventually lead to eviction and displacement of indigenous communities from their ancestral land.
Over the last three days, the All Tiwa Students’ Union along with several other tribal organisations carried out protest rallies and demonstrations in the area. The groups demanded complete cancellation of the proposed township project and said suspension of the survey alone would not address the concerns of the affected people. Protesters alleged that local communities had not been properly consulted before the survey work began. Several organisations also urged the government to protect tribal belt land and ensure that development projects do not affect the rights and livelihoods of indigenous residents. Officials said the proposed satellite township was being planned near the Tata Electronics Outsourced Semiconductor Assembly and Test (OSAT) facility coming up in Jagiroad. The project is considered one of the largest industrial investments announced in Assam in recent years.
The semiconductor unit is being set up with an investment of Rs 27,000 crore and is expected to manufacture up to 48 million semiconductor chips per day. According to officials, the plant will use advanced packaging technologies including flip chip and Integrated System in Package (ISIP). The proposed township was expected to support infrastructure and residential requirements linked to the semiconductor project. However, following the protests and objections raised by tribal organisations, the administration has decided to stop the survey process for the time being.
